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The directory now references a total of 35 technology solutions, up from 28 in last year’s review.
This
unique directory comprises new technology offerings, as well as new
features of previously included solutions. It helps compare the
different solutions and understand whether they are aimed at
underwriters, investors, issuers or others, at what stage of the
issuance process they can be utilised, the scope of debt instruments and
supported issuance methods. The latest edition also includes a new
search filter to identify solutions more easily based on product focus.
Key observations
New
solutions, expected to go live in Q4 2020, are targeting the new issue
process of syndicated bonds, aiming to enhance workflow and streamline
communication between issuers, banks and investors, and enable
connectivity to order management systems. Straight-through-processing
appears to be a key theme also for private placements, as evidenced by
new functionalities of platforms, for example, to automate the creation
of final terms, or by extended connectivity options. The number of
platforms for the issuance of Schuldscheine has further increased and in
some instances, the product scope has been expanded to bonds, or
sustainability-linked debt instruments.
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This initiative complements ICMA’s directories of Electronic Trading Platforms, Repo Trading technologies and FinTech solutions for repo and cash bond operations.
The
directory does not constitute an exhaustive list of providers in the
market. Relevant providers that are not yet covered by the mapping
directory and wish to join are very welcome.